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SIA Applauds DOE Initiative to Advance U.S. Supercomputing Technology

Exascale Computing Project awards $258 million over three years to six U.S. tech companies, including SIA members AMD, IBM, Intel

Published Friday, June 16, 2017 10:00 am

WASHINGTON—June 16, 2017—The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following statement from president & CEO John Neuffer commending the U.S. Department of Energy’s announcement of new research funding to deploy America’s first exascale supercomputers. The public-private partnership, part of the PathForward program within DOE’s Exascale Computing Project, will allocate $258 million over three years to six U.S. tech companies, including SIA members AMD, IBM, and Intel. The companies will provide additional funding of at least 40 percent of the total project cost, bringing the total investment to at least $430 million.

“From curing diseases and making passenger jets safer to improving weather forecasts and developing new advanced manufacturing techniques, supercomputing enables countless breakthroughs that keep America strong, safe, competitive, and at the tip of the spear of innovation. The development of exascale supercomputers, many times faster than today’s top supercomputers, holds tremendous promise for a wide range of applications, including emerging areas like artificial intelligence and data analytics.

“While the United States currently leads the world in the application of supercomputing to real-world problems, China is home to the world’s two fastest supercomputers and other countries recently have made significant investments in supercomputing technology to bridge the gap. Without swift and determined action by policymakers to help advance supercomputing technology, the United States risks falling behind.

“DOE’s PathForward program will go a long way toward launching America’s first exascale supercomputers and strengthening U.S. economic and technological leadership.”

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