SIA Applauds New DARPA Investments in JUMP Centers

Wednesday, Jan 24, 2018, 6:00pm

by Semiconductor Industry Association

Building on more than a decade of collaborations, DARPA and the Semiconductor Research Corporation (SRC) have announced the next phase of their partnership to advance semiconductor technologies that will help strengthen our national security. The partners kicked off their new Joint University Microelectronics Program (JUMP) with the launch of six new research centers led by leading U.S. universities.


The $200 million JUMP program, one key part of DARPA’s broader Electronics Resurgence Initiative (ERI) launched in 2017, aims to develop systems and technologies that can be transferred to military and industry partners within five years of the program’s completion and fielded within ten. The new program is organized in six centers, each a consortium of researchers that span a total of more than 30 U.S. universities. The centers will focus on brain-inspired computing (CBRIC), led by Purdue University; terahertz communications and sensing (ComSenTer), led by University of California, Santa Barbara; computing on network infrastructure (CONIX), led by Carnegie Mellon University; intelligent storage and processing in memory (CRISP), led by the University of Virginia; advancing design and manufacturing technologies (ADA), led by the University of Michigan; and energy efficient integrated nanotechnologies (ASCENT), led by the University of Notre Dame.

Driving innovation in the semiconductor industry through public-private partnerships and federally funded scientific research has been a longstanding priority for SIA. The U.S. semiconductor industry is one of the most R&D intensive sectors of the U.S. economy, putting on average nearly 20 percent of revenues into R&D each year, totaling some $34 billion in 2016. Through the JUMP program, DARPA’s broader Electronics Resurgence Initiative, and other public-private partnership programs, SIA members work hand in hand to fund the fundamental science and technology development that will be key to future semiconductor technologies and help train the next generation of semiconductor innovators.

 SIA looks forward to working with DARPA and leaders in Washington to ensure robust federal support for scientific research that will strengthen our national security, keep the U.S. semiconductor industry at the bleeding edge of innovation, and grow our economy.