This week, SIA testified before the International Trade Commission (ITC) on the Administration’s proposed fourth tranche of tariffs on $300 billion in trade with China as part of the Section 301 investigation into China’s unfair acts, policies, and practices. If implemented, the proposed fourth round of tariffs will encompass virtually all information technology products, including […]
A coalition of U.S. and Pakistan business organizations, led by SIA and the U.S.-Pakistan Business Council, have sent a letter to Prime Minister Shahid Abbasi of Pakistan urging the Pakistan government to join the WTO Information Technology Agreement (ITA) and ITA expansion. The letter is part of a broader global industry push to expand the […]
This year marks the 20th anniversary of the World Trade Organization (WTO) Information Technology Agreement (ITA), a groundbreaking trade pact that eliminates tariffs on hundreds of high-tech products, from semiconductors to smart phones. During a keynote address yesterday at a WTO Symposium in Geneva marking the ITA’s 20th anniversary, SIA President and CEO John Neuffer highlighted […]
SIA President & CEO John Neuffer and other leaders from industry, government and academia participated in a panel discussion this week on the benefits of the WTO Information Technology Agreement (ITA), a pioneering trade pact that eliminates tariffs on hundreds of high-tech products, from semiconductors to smart phones. Panelists highlighted the ITA’s key role in […]
The world’s leading semiconductor industries celebrated the 20th anniversary of the establishment of the World Semiconductor Council (WSC) on May 27 in Seoul, Korea. The WSC grew out of the 1996 U.S.-Japan Agreement on International Cooperation Regarding Semiconductors and today brings together senior executives from six semiconductor-producing regions – China, Chinese Taipei, EU, Japan, Korea, […]
Few industries, if any, feature a value chain as complex, geographically dispersed, and intensely interconnected as that of the semiconductor industry. This highly globalized and interdependent structure has been an amazing success story, benefitting the semiconductor industry, participating countries, and the global economy. These benefits, as well as the risks of an insular approach to […]
President Obama released his 2016 Trade Policy Agenda on March 2. This thick document includes a raft of trade priorities for this Administration, including major trade agreements either under negotiation or completed: Trans-Pacific Partnership (TPP), Transatlantic Trade and Investment Partnership (TTIP), Environmental Goods Agreement (EGA), Trade in Services Agreement (TiSA), and expansion of the Information […]
SIA today testified at a hearing of the U.S. International Trade Commission (ITC) about the critical importance of the Trans-Pacific Partnership (TPP) to the U.S. semiconductor industry and the U.S. economy. Our core message was that trade is vital to the semiconductor industry’s ability to compete, innovate, and grow. SIA highlighted three specific ways the […]
SIA today welcomed the public release of the final text of the Trans-Pacific Partnership (TPP), a landmark trade agreement that sets key parameters for trade in the digital economy of the 21st Century. The TPP has the potential to strengthen the U.S. semiconductor industry, the broader tech sector, and the global economy.
In a strong statement released today, more than 80 associations from around the world have again weighed in urging parties negotiating expansion of the Information Technology Agreement (ITA) to implement their tariff elimination commitments as quickly as possible, showing restraint in their requests for extended “staging.” Parties will meet again the week of Nov. 9 in […]
Following the hard-fought agreement achieved in July on the product list to expand the Information Technology Agreement (ITA), negotiators will return to Geneva next week to sort through implementation timeframes for the 201 high-tech product lines to be covered by ITA expansion. These timeframes are known as “staging,” the periods over which tariffs are eliminated. […]
SIA welcomes the news that U.S. Trade Representative Michael Froman formally delivered the United States’ letter of acceptance of the WTO Trade Facilitation Agreement (TFA) to the WTO Director in Davos, Switzerland on Friday. Delivery of the letter was a welcome final step in U.S. acceptance of the Agreement. The TFA will enter into force […]
Following a key breakthrough between China and the United States on the sidelines of the APEC Leaders meeting in Beijing in November, negotiators have returned to Geneva to resume, and hopefully conclude, an expanded Information Technology Agreement that extends duty-free coverage to approximately 200 new technology product lines. Included on this list of new products are […]
Following a key breakthrough between China and the United States on the sidelines of the APEC Leaders meeting in Beijing in November, negotiators return to Geneva tomorrow to resume, and hopefully conclude, an expanded Information Technology Agreement that extends duty-free coverage to approximately 200 new technology product lines, including next-generation semiconductors known as multi-component semiconductors […]
Last Friday, SIA and several other U.S. high tech industry association representatives participated in a roundtable dialogue with Director Zhao Tianwu and other officials from China’s Ministry of Industry and Information Technology (MIIT) Electronics Intellectual Property Rights (IPR) Center. The MIIT Electronics IPR Center is highly influential in shaping Chinese policy on matters such as […]
This week, semiconductor industry representatives from around the world will meet in Fukuoka, Japan to deliver recommendations to global governments on a range of trade issues at the 15th annual Governments/Authorities Meeting on Semiconductors (GAMS).
Last week, members of the World Trade Organization (WTO) missed an important deadline to implement the Trade Facilitation Agreement (TFA) due to objections from India, South Africa and a few other developing countries.
Despite intense efforts and high hopes for China to show leadership and break the deadlock in talks to expand the scope of the Information Technology Agreement (ITA) at this week’s U.S.-China Strategic & Economic Dialogue (S&ED), no agreement was reached and negotiations will continue after an already lengthy 8-month delay.
In a letter released today, the World Semiconductor Council (WSC) — representing semiconductor industry leaders in China, Chinese Taipei, Europe, Japan, Korea and the United States — urged the trade ministers from the 21 Asia-Pacific Economic Cooperation (APEC) economies gathering in Qingdao, China on May 17-18 to reach a breakthrough in the negotiations to significantly […]
The semiconductor industry plays a critical role in driving U.S. innovation. For example, American semiconductor companies invested $32 billion in research and development in 2012 – one of the greatest shares of revenue of any industry. In order to ensure that these investments continue to benefit consumers around the world, strong intellectual property rights (IPR) […]
Strengthening America’s science, technology, engineering and math (STEM) education is a perennial priority for SIA. SIA has long engaged in efforts to ensure that the U.S. develops and retains future generations of top scientific minds, including through advocacy for national initiatives to bolster STEM education and through direct participation in programs that get kids interested […]
SIA recently submitted written comments for the 2014 Special 301 Review, an annual report issued by the Office of the U.S. Trade Representative (USTR) addressing the adequacy and effectiveness of U.S. trading partners’ protection and enforcement of intellectual property (IP) rights.
A recently published paper, written by Takaaki Sashida, a graduate student at the Harvard Kennedy School of Government and recent research fellow at SIA, provides an in-depth exploration of the importance of incorporating encryption rules in the Trans-Pacific Partnership (TPP) Agreement.
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