CHIPS Incentives Awards - Semiconductor Industry Association

Tracking the CHIPS Incentives Program Awards

Last updated July 26, 2024

The CHIPS Act’s manufacturing incentives have sparked substantial investments in the U.S. In fact, companies in the semiconductor ecosystem have announced dozens of new projects across America—totaling nearly $450 billion in private investments—since the CHIPS Act was introduced. These announced projects will create more than 56,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.

Thus far, the CHIPS Program Office (CPO) has announced $30.4376 billion in grant awards and up to $25.3 billion in loans to 14 companies across 24 projects in 14 states. These projects include total investment of more than $350 billion over two decades, with the vast majority invested by 2030. The projects are also expected to create over 110,000 new jobs – over 35,000 manufacturing jobs and over 75,000 construction jobs. Dozens of additional award announcements are expected in the months ahead. The announcements thus far are for a preliminary memorandum of terms (PMTs), which is a non-binding agreement between companies and the CHIPS Program Office. A due diligence stage follows a PMT, after which funds will be disbursed.

SIA looks forward to working with the Commerce Department to ensure the CHIPS Act is implemented in an effective, efficient, and timely manner. Doing so will help reinvigorate U.S. chip production and innovation and deliver major benefits for America’s economy, job creation, national security, supply chain resilience, and technology leadership.

SIA will update this webpage with the latest developments in the CHIPS incentives program as new announcements are made regarding awards to commercial fabrication facilities, facilities for the manufacturing of semiconductor equipment and materials, and R&D facilities.

Amkor

Location: Peoria, AZ

Incentive Amount: $400 million in grants, $200 million in laons

Project Size: $2 billion

Project Type: New Facility

Technology: Advanced Packaging and Test

Commerce Press Release

Additional Information: “This proposed funding would support Amkor’s investment of approximately $2 billion and 2,000 jobs in a greenfield project in Peoria, Arizona, which will provide full end-to-end advanced packaging for the world’s most advanced semiconductors for applications in high-performance computing, artificial intelligence, communications, and automotive, end markets. Amkor’s use of 2.5D technology is foundational for meeting the rapidly increasing demand for generative AI products and services as it is the final step in the manufacturing of graphic processing units (“GPUs”) for high-performance computing applications and other AI chips. When fully operational, Amkor will package and test millions of leading-edge chips serving autonomous vehicles, 5G/6G smartphones, and large-scale datacenters across a range of customers.”

Date of PMT: July 26

Peoria City Council Approves Development Agreement Paving The Way For Amkor's Advanced OSAT Facility - Amkor Technology

Rogue Valley Microdevices

Location: Sherman, TX

Incentive Amount: $400 million across all projects

Project Size: $4 billion across all projects

Project Type: New Facility, Expansion

Technology: Wafers

Commerce Press Release

Additional Information: “Establish the first 300mm silicon wafer manufacturing facility for advanced chips in the United States. Of note, 300mm silicon wafers are a key input used by foundries and integrated device manufacturers to manufacture leading-edge, mature-node, and memory chips. […] GlobalWafers plans to convert a portion of its existing silicon epitaxy wafer manufacturing facility in Sherman, Texas to silicon carbide (“SiC”) epitaxy wafer manufacturing, producing 150mm and 200mm SiC epitaxy wafers. SiC epitaxy wafers are a critical component for high-voltage applications, notably including electric vehicles and clean energy infrastructure.”

Date of PMT: July 17

GlobalWafers breaks ground for Texas factory, expects mass production in 2024

Rogue Valley Microdevices

Location: St. Peters, MO

Incentive Amount: $400 million across all projects

Project Size: $4 billion across all projects

Project Type: New Facility

Technology: Wafers

Commerce Press Release

Additional Information: “Establish a new facility to produce 300mm silicon-on-insulator (“SOI”) wafers. Importantly, SOI wafers allow for significantly improved performance in harsh environments and are commonly used in defense and aerospace end uses.”

Date of PMT: July 1

MEMC Awarded Funding by Energy Department | St. Peters, MO Patch

Rogue Valley Microdevices

Location: Palm Bay, FL

Incentive Amount: $6.7 million

Project Size: $25 million

Project Type: New Facility

Technology: MEMS (mature-node)

Commerce Press Release

Additional Information: “The proposed CHIPS investment would support the construction of RVM’s pure play microelectromechanical systems (MEMS) and sensor foundry facility in Palm Bay, Florida, and is estimated to nearly triple RVM’s manufacturing capacity. MEMS are microscale devices that integrate electrical and mechanical components; their integration with semiconductor components across a wide range of applications enables technology advancements and improved performance. RVM is one of the only U.S.-based pure play MEMS foundries which specializes in the high-mix, low-volume wafer and MEMS foundry services that are important to the defense industrial base and to the biomedical industry. With this proposed investment, the Biden-Harris Administration would be supporting a reliable, domestic supply of MEMS devices manufactured on 300mm wafers, further strengthening U.S. supply chain resilience while creating over 75 jobs in the state of Florida.”

Date of PMT: July 1

Rogue Valley Microdevices Inc. of Medford, Oregon, is considering expanding into this building at 2301 Commerce Drive NE, Palm Bay.

Entegris

Location: Colorado Springs, CO

Incentive Amount: $75 million

Project Size: $600 million

Project Type: New Facility

Technology: Equipment and Materials

Commerce Press Release

Additional Information: “The proposed CHIPS investment would support Entegris’ construction of its state-of-the-art manufacturing center in Colorado Springs. The center is being built in multiple phases: the first to support production of FOUPs—which are currently entirely produced abroad—and liquid filter membranes, and the second phase to support the production of advanced liquid filters and purifiers as well as fluid handling solutions. Entegris is a leading supplier of advanced materials and process solutions for the semiconductor and other high-technology industries. Notably, the company invented the Front Opening Unified Pods (FOUPs), which are the highly specialized containers that secure semiconductor wafers while they are handled and transported during the manufacturing process. The proposed investment would create nearly 600 direct manufacturing jobs over a period of several years and approximately 500 construction jobs by 2030.”

Date of PMT: June 26

SolAero (Rocket Lab)

Location: Albuquerque, NM

Incentive Amount: $23.9 million

Project Size: Not Available

Project Type: Modernization, Expansion

Technology: Mature-Node

Commerce Press Release

Additional Information: “The proposed CHIPS investment would help create a more robust and resilient supply of space-grade solar cells that power spacecrafts and satellites. The modernization and expansion project would increase Rocket Lab’s compound semiconductor production by 50% within the next three years – helping to meet the growing national security and commercial demand for these solar cells in the United States. Rocket Lab is one of two companies in the United States that specialize in the production of highly efficient and radiation resistant compound semiconductors called space-grade solar cells – devices used in space to convert light to electricity. The proposed investment would create over 100 direct manufacturing jobs.”

Date of PMT: June 11

Absolics

Location: Covington, GA

Incentive Amount: $75 million

Project Size: $600 million

Project Type: New Facility

Technology: Materials for Advanced Packaging

Commerce Press Release

Additional Information: “The proposed CHIPS investment would support the construction of a 120,000 square-foot facility in Covington, Georgia and the development of substrates technology for use in semiconductor advanced packaging. Absolics glass substrates will be used as an important advanced packaging technology to increase the performance of leading-edge chips for AI, high-performance compute and data centers by reducing power consumption and system complexity. The glass substrates produced by Absolics enable smaller, more densely packed, and shorter length connections resulting in faster and more energy efficient computing. This proposed investment would support over an estimated 1,000 construction jobs and approximately 200 manufacturing and R&D jobs in Covington and enhance innovation capacity at Georgia Institute of Technology (Georgia Tech), supporting the local semiconductor talent pipeline.”

Date of PMT: May 23

Korean Plant in Covington Poised to Get $75M From Federal Government - Global Atlanta

Polar Semiconductor

Location: Bloomington, MN

Incentive Amount: $120 million

Project Size: $525 million

Project Type: Expansion, Modernization

Technology: Mature-Node

Commerce Press Release

Additional Information: “This proposed funding would catalyze investment from private and state sources to expand Polar’s manufacturing facility and introduce new technology capabilities in Bloomington, Minnesota. The expansion and modernization would enable Polar to double its U.S. production capacity of sensor and power chips within two years. Additionally, this proposed investment would bring in more U.S. private capital, which would transform Polar from a majority foreign-owned in-house manufacturer to a majority U.S.-owned commercial foundry, expanding opportunities for U.S. chip designers to innovate and produce technologies domestically.”

Date of PMT: May 13

Micron

Location: Clay, NY

Incentive Amount: Across all Micron projects, $6.14 billion in grants and $7.5 billion in loans

Project Size: $100 billion

Project Type: 4 new fabs

Technology: Leading-edge

Commerce Press Release

Additional Information: “Construct first two fabs of planned four fab “megafab” focused on leading-edge DRAM chip production. Each fab will have 600,000 square feet of cleanrooms, totaling 2.4 million square feet of cleanroom space across the four facilities—the largest amount of cleanroom space ever announced in the United States and the size of nearly 40 football fields.”

Date of PMT: April 25

Biden is giving Micron $6 billion in CHIPS funding : NPR

Micron

Location: Boise, ID

Incentive Amount: Across all Micron projects, $6.14 billion in grants and $7.5 billion in loans

Project Size: $25 billion

Project Type: 1 new fab

Technology: Leading-edge

Commerce Press Release

Additional Information: “Develop a high-volume manufacturing (HVM) fab, with approximately 600,000 square feet of cleanroom space focused on the production of leading-edge DRAM chips. The fab would be co-located with the company’s R&D facility to improve efficiency across their R&D and manufacturing operations, reducing lags in technology transfer and cutting time-to-market for leading-edge memory products.”

Date of PMT: April 25

Groundbreaking event | Micron Technology Inc.

Samsung

Location: Taylor, TX

Incentive Amount: Across all Samsung projects, $6.4 billion in grants

Project Size: $45 billion across all projects

Project Type: 2 new fabs, 1 new R&D fab, 1 new advanced packaging facility

Technology: Leading-edge, advanced packaging

Commerce Press Release

Additional Information: “Construct a comprehensive advanced manufacturing ecosystem, ranging from leading-edge logic to advanced packaging to R&D, transforming the small municipality of Taylor into an expansive hub of leading-edge semiconductor manufacturing. This ecosystem would include two leading-edge logic foundry fabs focused on mass production of 4nm and 2nm process technologies, an R&D fab dedicated to development and research on technology generations ahead of nodes currently in production, and an advanced packaging facility producing 3D High Bandwidth Memory and 2.5D packaging, both of which have critical artificial intelligence applications. The semiconductors that are designed and manufactured in this ecosystem would serve a wide variety of end markets – from communications, automotive, and defense industries to high-performance computing and artificial intelligence.”

Date of PMT: April 15

U.S. Secretary of Commerce Gina Raimondo announces the $6.4 billion grant at the Samsung semiconductor plant in Taylor. The money is available through the federal CHIPS and Science Act.

Samsung

Location: Austin, TX

Incentive Amount: Across all Samsung projects, $6.4 billion in grants

Project Size: $45 billion across all projects

Project Type: Facility expansion

Technology: Mature-node

Commerce Press Release

Additional Information: “Expand a facility that has been an economic engine for Central Texas for nearly 30 years. This proposed investment would expand the existing facilities to support the production of leading fully depleted silicon-on-insulator (FD-SOI) process technologies for critical U.S. industries, including aerospace, defense, and automotive. This proposed investment also includes commitments to collaborate with the U.S. Department of Defense.”

Date of PMT: April 15

Samsung weighs huge Austin-area growth: 11 new fabs, 10,000 new jobs

TSMC

Location: Phoenix, AZ

Incentive Amount: $6.6 billion in grants, $5 billion in loans

Project Size: $65 billion

Project Type: 3 new fabs

Technology: Leading-edge

Commerce Press Release

Additional Information: “In Arizona, TSMC’s three fabs are expected to bring a suite of the most advanced process node technologies to the United States: the first fab will produce 4nm FinFET process technologies; today, TSMC Arizona announced that the second fab will produce the world’s most advanced 2nm nanosheet process technology, in addition to previously announced plans to produce 3nm process technologies; and TSMC Arizona’s third fab will produce 2nm or more advanced process technologies depending on customer demand. At full capacity, TSMC Arizona’s three fabs would manufacture tens of millions of leading-edge chips that will power products like 5G/6G smartphones, autonomous vehicles, and AI datacenter servers. TSMC Arizona expects to begin high-volume production in their first fab in the U.S. by the first half of 2025.”

Date of PMT: April 8

TSMC Arizona - Taiwan Semiconductor Manufacturing Company Limited

Intel

Location: Chandler, AZ

Incentive Amount: Across all Intel projects, $8.5 billion in grants and $11 billion in loans

Project Size: $32 billion

Project Type: 2 new fabs

Technology: Leading-edge

Commerce Press Release

Additional Information: “Construction of two new leading-edge logic fabs and modernization of one existing fab, significantly increasing leading-edge logic capacity, including high volume domestic production of Intel 18A – the company’s most advanced chip design that enables higher performing, leading-edge chips through RibbonFET gate-all-around transistors and PowerVia backside power delivery. The company will produce the first Intel 18A product, called Clearwater Forest, at its Arizona facilities. In 2022, Intel partnered with Maricopa County Community Colleges to launch a first-of-its-kind program with Intel employee-instructors to provide students an entry point into semiconductor technician careers. This investment will support 3,000 manufacturing jobs and 6,000 construction jobs.”

Date of PMT: March 20

Biden touts 'landmark agreement' with Intel during visit to Arizona | The Hill

Intel

Location: New Albany, OH

Incentive Amount: Across all Intel projects, $8.5 billion in grants and $11 billion in loans

Project Size: $28 billion

Project Type: 2 new fabs

Technology: Leading-edge

Commerce Press Release

Additional Information: “Creation of a new regional chipmaking ecosystem, anchored by the construction of two leading-edge logic fabs, expanded leading-edge foundry capacity, and supply chain diversification. Intel has devoted significant resources to develop a pipeline of skilled workers in Ohio, funding over 80 institutions of higher education across the state, including community colleges, HBCUs, and universities. As part of this investment in Ohio, Intel’s design and build partner Bechtel signed a Project Labor Agreement (PLA) with the North America Building Trades Unions for the construction of the two facilities. This investment will support 3,000 manufacturing jobs and 7,000 construction jobs.”

Date of PMT: March 20

Intel confirms delay, details progress on Ohio semiconductor factories - Columbus Business First

Intel

Location: Rio Rancho, NM

Incentive Amount: Across all Intel projects, $8.5 billion in grants and $11 billion in loans

Project Size: $4 billion

Project Type: 2 modernizations

Technology: Advanced Packaging

Commerce Press Release

Additional Information: “Modernization of two fabs into advanced packaging facilities to close an important gap in the domestic semiconductor supply chain. When in full production, this facility will be the largest advanced packaging facility in the United States. To support engineering students in New Mexico, Intel established endowment scholarships at five colleges and universities and has supported STEAM education through investments, annual grants, and hands-on learning kits benefitting students living on indigenous lands. This investment will support 700 manufacturing jobs and 1,000 construction jobs.”

Date of PMT: March 20

Intel in New Mexico

Intel

Location: Hillsboro, OR

Incentive Amount: Across all Intel projects, $8.5 billion in grants and $11 billion in loans

Project Size: $36 billion

Project Type: Modernization, Expansion

Technology: R&D, leading-edge

Commerce Press Release

Additional Information: “Investment in the premier hub of leading-edge development in the United States through the expansion and modernization of technology development facilities that will utilize the world’s first High NA EUV lithography equipment. The Gordon Moore Park campus at Ronler Acres in Hillsboro, Oregon is the heart of Intel’s innovation hub for leading-edge semiconductor research and technology development in the United States. These investments will further the company’s technological leadership and enable the continued development of new innovations. In 2022, Intel spent more than $4 billion with more than 500 suppliers across Oregon. This investment will support several thousand manufacturing and construction jobs. ”

Date of PMT: March 20

Intel in Oregon

GlobalFoundries

Location: Malta, NY

Incentive Amount: $1.375 billion in grants, $1.6 billion in loans

Project Size: $11.6 billion

Project Type: New facility and facility expansion

Technology: Current-generation, mature-node

Commerce Press Release

Additional Information: “The construction of a new, large-scale 300 mm fabrication facility that is expected to produce high value technologies not currently available in the U.S. The new facility is intended to leverage existing infrastructure to expedite the path from construction to production. The proposed expansion of the existing Malta, New York fabrication facility, which includes a strategic agreement with General Motors, to secure a dedicated supply of essential semiconductor technologies. This project would also support America’s economic and national security by expanding domestic capacity for semiconductors that are used in the U.S. critical infrastructure base. This expansion, combined with the new 300 mm fabrication facility, is expected to triple the existing capacity of the Malta campus over the next 10+ years. These two projects are expected to increase wafer production to 1 million per year once all phases are complete.”

Date of PMT: Feb. 19

GlobalFoundries

Location: Essex Junction, VT

Incentive Amount: $125 million

Project Size: $900 million

Project Type: Revitalization

Technology: Mature-node

Commerce Press Release

Additional Information: “The revitalization of an existing fabrication facility in Burlington, Vermont, to commercialize new 200 mm technologies, creating the first U.S. facility capable of high-volume manufacturing of next-generation Gallium Nitride on Silicon for use in electric vehicles, power grid, 5G and 6G smartphones, and other critical technologies. The site will apply industry-leading sustainability practices, including the use of 100% carbon-neutral energy and the development of an onsite solar system to supply up to 9% of the site’s annual energy.”

Date of PMT: Feb. 19

Microchip Technology

Location: Colorado Springs, CO

Incentive Amount: $90 million

Project Type: Modernization and Expansion

Technology: Mature-node

Commerce Press Release

Additional Information: Alongside an award to Microchip’s facility in Gresham, OR, “this investment would enable Microchip to significantly increase its U.S. production of microcontroller units (MCUs) and other specialty semiconductors built on mature-nodes critical to America’s automotive, commercial, industrial, defense, and aerospace industries and create over 700 direct construction and manufacturing jobs. The projects are estimated to nearly triple the share of semiconductors the company produces at these sites, decreasing its reliance on foreign foundries and strengthening supply chain resilience.”

Date of PMT: Jan. 4

Growing the Colorado Semiconductor Industry: Microchip to Expand in Colorado Springs - Colorado Springs Chamber & EDC

Microchip Technology

Location: Gresham, OR

Incentive Amount: $72 million

Project Type: Modernization

Technology: Mature-node

Commerce Press Release

Additional Information: Alongside an award to Microchip’s facility in Colorado Springs, CO, “this investment would enable Microchip to significantly increase its U.S. production of microcontroller units (MCUs) and other specialty semiconductors built on mature-nodes critical to America’s automotive, commercial, industrial, defense, and aerospace industries and create over 700 direct construction and manufacturing jobs. The projects are estimated to nearly triple the share of semiconductors the company produces at these sites, decreasing its reliance on foreign foundries and strengthening supply chain resilience.”

Date of PMT: Jan. 4

A low-slung white industrial building with snow-capped Cascade foothills in the backround.

BAE Systems

Location: Nashua, NH

Incentive Amount: $35 million

Project Type: Modernization

Technology: Mature-node

Commerce Press Release

Additional Information: “These incentives will support the modernization of the company’s Microelectronics Center, a mature-node facility in Nashua, New Hampshire. This modernization project will replace aging tools and quadruple the production of chips necessary for critical defense programs, including the $1.7 trillion F-35 fighter jet program.”

Date of PMT: Dec. 11

Biden administration chooses Nashua BAE plant for first $35 million grant under CHIPS Act | New Hampshire Public Radio