Semiconductor Workforce Development: A Policy Blueprint



Webinar: Trends and Challenges in Semiconductor Advanced Packaging

Date: Tuesday, Sept. 29
Time: 11 am EDT

Innovations in how semiconductors are packaged have enabled the global semiconductor industry to achieve additional advancements on top of those traditionally gained during the “front-end” manufacturing process. Many packaging technologies exist today, and selecting the correct one is no longer an afterthought but an integral part of semiconductor manufacturing. For semiconductor firms known as OSATs that specialize in the “back-end” assembly, test, and packaging, the current environment poses both unique challenges and opportunities.

Please join a panel of industry experts for a conversation about the current trends and challenges in semiconductor advanced packaging. Panelists include Santosh Kumar, Director & Principal Analyst in the Semiconductor & Software Division at Yole Développement; Guillaume Assogba, PhD, Economist at Yole Développement; John Stone, Executive Vice President and Chief Sales Officer, Worldwide Sales & Marketing at Amkor Technology, Inc.; and Falan Yinug, Director of Industry Statistics and Economic Policy at the Semiconductor Industry Association.


A Yole Perspective 
Guillaume Assogba, Yole

Advanced Packaging Current Trends and Challenges
Santosh Kumar, Yole

Trends and Challenges in Semiconductor Advanced Packaging
John Stone, Amkor



Sept. 29, 2020




Santosh Kumar
Director & Principal Analyst in the Semiconductor & Software division
Yole Développement

Santosh Kumar is currently working as Director & Principal Analyst in the Semiconductor & Software Division at Yole Développement, part of Yole Group of Companies. His main interest areas are advanced electronic packaging materials and technology including TSV and 3D packaging, modeling and simulation, reliability and material characterization, wire bonding and novel solder materials and process etc. He received bachelor and master degrees in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul, respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.


Guillaume Assogba
Yole Développement

Guillaume Assogba, PhD, serves as an Economist at Yole Développement (Yole), part of Yole Group of Companies. Assogba carries out research on all aspects of worldwide economic activity with a key focus on the consumer, transport, defense & aeronautic, medical and industrial markets. This involves collecting and analyzing large amounts of information on all economic spheres. He works closely with Yole’s technology & market analysts to assist them with their market investigations all year long. He helps them to gain in-depth understanding of the macroeconomic trends, to take global market figures into account within their top-down market analyses, for example. Prior to Yole, Assogba developed expertise related to the economies of industrial organizations and innovation while working in innovation economics at Michelin (France) and Group SEB R&D centers (France). Assogba graduated with a PhD, Industrial Organization & Innovation Economy from University of Bordeaux (France).


John Stone
Executive Vice President and Chief Sales Officer, Worldwide Sales & Marketing
Amkor Technology, Inc.

John Stone joined Amkor in 2002 and is currently Executive Vice President and Chief Sales Officer of Worldwide Sales and Marketing. Stone also serves as a board member on Amkor’s business entities in Singapore and Japan. He has more than 30 years of semiconductor industry experience in engineering, engineering management, sales management and Marcom. Prior to Amkor, Stone held executive and management positions with ChipPAC, Kyocera America, Sumitomo America and General Electric. Stone holds a B.S. degree in Mechanical Engineering from Purdue University and a master’s in business administration from Florida Atlantic University.


Falan Yinug
Director, Industry Statistics and Economic Policy
Semiconductor Industry Association

Falan Yinug is director of industry statistics and economic policy at SIA. Responsible for managing SIA’s statistics and data program, Yinug represents SIA in the World Semiconductor Trade Statistics (WSTS) program, which maintains industry-driven monthly sales data for the global industry as well as sales forecasts. His work also entails supporting SIA’s advocacy efforts through economic research and analysis.