Within this paper, the PFAS Consortium identifies applications of PFAS within the ATPS processes and potential and replacement alternatives. Given that the assembly process is an interaction between the fabrication plant and the end product, it is possible that there could be die and passivation materials from multiple fabrication plants, or multiple PCBs and second-level interconnect materials. This creates extensive complexity: a change in one assembly material could require testing across multiple silicon die or second-level interconnect vendors or the electronic customer incorporating the package into their final product.    

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PFAS-Containing Materials Used in Semiconductor Manufacturing Assembly Test Packaging and Substrate Processes