Materials containing per and poly-fluoroalkyl substances (PFAS) have become a cornerstone of functionality in semiconductor manufacturing because of their unique chemical properties. In the case of surfactants, PFAS are vital to enabling surface coat uniformity, complete resist removal with low defectivity, improved line roughness and reduced line collapse. This paper presents case studies on the removal of PFAS-containing surfactants in lithographic materials. There is no drop-in solution that would fit all surfactant use applications, however, making the replacements of these materials costly and time-consuming. Full replacement of PFAS-containing materials may not be possible for some of the most exacting applications.
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