In-person registration is now closed. Virtual attendance registration is available below.
To coincide with the International Solid State Circuits Conference (ISSCC), SIA will hold an in-person CTO Committee meeting with Dr. Subramanian Iyer, Director of the National Advanced Packaging Manufacturing Program (NAPMP), in San Francisco at IBM’s offices located at 425 Market St. from 12:00pm-2pm (pacific) on Tuesday, February 20.
We request attendance from CTOs and senior technology representatives with expertise in your organization’s advanced packaging efforts.
A remote option will be available for those unable to attend. Lunch will be provided for those attending in person, please indicate below whether you plan to join in person or virtually. We look forward to seeing you at the meeting.
Please contact Erik Hadland at email@example.com with any questions.